超移动设备微处理器研究报告

报告简介：

摘要

Why is the ultra mobile device (UMD) segment so important? Because it is likely to be the next billion units of gold for semiconductor and consumer electronics vendors, while driving a new level of innovation through communication standards, Internet applications, and service and usage models.

This report examines one of the most critical issues in the UMD market: the battle between processor architectures, which are the hearts and brains of these new devices. The leading contenders in this battle include the x86 camp, led by Intel, and the ARM camp, led by companies like Freescale, NVIDIA, Qualcomm, Samsung, and Texas Instruments.

The following information is included in the report:

• Overview of the market and drivers for UMDs.
• Company background, manufacturing strategies, product strategies, and current product details from each of the key x86 and ARM companies, including AMD, ARM, Freescale, Intel, NVIDIA, Qualcomm, Samsung, STMicroelectronics, Texas Instruments, and VIA.
• Overview of the battle between the x86 and ARM architectures, including the current advantages and disadvantages of both.
• Predictions on how the market is likely to evolve.

目录及图表

Executive Summary

Introduction

A Tale of Two Architectures: x86 vs. ARM

Intel

ARM

Background

Major ARM Licensees

Texas Instruments (TI)

Freescale

Qualcomm

NVIDIA

Samsung

VIA Technologies

VIA’s Mobile and Ultra-Mobile Microprocessors

VIA C7-M

VIA Nano

Others

AMD

STMicroelectronics

Conclusion

Methodology

Intel’s Wafer Capacity

Glossary

List of Tables

List of Figures

Related In-Stat Reports

List of Tables

Table 1. Intel Fabrication Facilities and Estimated Wafer Capacities

Table 2. Intel Atom Microprocessors

Table 3. System Controller Hubs (SCHs) for the Centrino Atom Platform

Table 4. Matrix of Atom Microprocessors to System Controller Hubs (SCHs)/Chipsets

Table 5. ARM Cortex-A8 and Cortex-A9 (MP and Single) Microprocessor Cores

Table 6. ARM 11 Microprocessor Cores

Table 7. ARM 9 Microprocessor Cores

Table 8. ARM Cortex Microprocessor Cores

Table 9. Freescale i.MX Applications Processor Product Line

Table 10. Qualcomm Snapdragon Applications Processors

Table 11. NVIDIA Tegra SoCs

Table 12. Samsung Applications Processors

Table 13. VIA C7-M Microprocessors

Table 14. VIA Nano Microprocessors

Table 15. STMicroelectronics Nomadik Applications Processors

List of Figures

Figure 1. The Internet Touches Nearly All Aspects of Consumers’ Lives

Figure 2. Paradigms: Increasing Miniaturization and Portability and Increasing Integration

Figure 3. Block Diagram of the Intel Atom Low-Power Microprocessor

Figure 4. Block Diagram of the Intel Poulsbo Chipset (Now Referred to as the System Controller Hub)

Figure 5. Block Diagram of the Intel Moorestown Platform

Figure 6. ARM’s Royalty Split between Vertical Markets During 1Q08

Figure 7. Block Diagram of the Texas Instruments ARM Cortex-A8-Based OMAP3430/OMAP3420

Figure 8. Block Diagram of the Texas Instruments OMAP3410 Applications Processor

Figure 9. Block Diagram of the Texas Instruments OMAP3440 Applications Processor

Figure 10. Block Diagram of the Freescale i.MXS Applications Processor

Figure 11. Block Diagram of the Freescale i.MXL Applications Processor

Figure 12. Block Diagram of the Freescale i.MX21(S) Applications Processor

Figure 13. Block Diagram of the Freescale i.MX27 Applications Processor

Figure 14. Block Diagram of the Freescale i.MX31(L) Applications Processor

Figure 15. Block Diagram of the Freescale i.MX32 Applications Processor

Figure 16. Block Diagram of the Freescale i.MX37 Applications Processor

Figure 17. Block Diagram of the Qualcomm Scorpion Microprocessor Core

Figure 18. Block Diagram of the Qualcomm Snapdragon System-on-a-Chip

Figure 19. Block Diagram of the NVIDIA Tegra System-on-a-Chip

Figure 20. Block Diagram of the Samsung S3C2412 Applications Processor

Figure 21. Block Diagram of the Samsung S3C2413 Applications Processor

Figure 22. Block Diagram of the Samsung S3C2443 Applications Processor

Figure 23. Block Diagram of the Samsung S3C6400 Applications Processor

Figure 24. Block Diagram of the Samsung S3C6410 Applications Processor

Figure 25. Block Diagram of the VIA C7-M Microprocessor (Based on Die Plot)

Figure 26. Block Diagram of the VIA Nano Microprocessor (Based on Die Plot)

Figure 27. Block Diagram of the AMD Forthcoming Shrike Mobile Platform